I used to work on the chemistry that went into the hard drives (have a couple patents too). The aluminum platters were electrolessly coated with a Ni-P (high phosphorous) deposition to hold the magnetic coating. The biggest challenge in the chemistry was controlling the Ni-P nodules (big bumps) that form during the process. The heads could crash into these nodules, or, these nodules could create voids as they were ripped out during the polishing step.
The desire for higher capacity drives (and smaller platters) meant the heads had to sit closer to the substrate. Controlling the EN (electroless nickel) deposition process was a challenge.
Heh..I knew which companies were buying our stuff so I always knew who made the best drives. :)
Worked on that for a few years then moved to copper deposition for semi-conductor chips. Got a mention from Intel for work we did for them. |
